Since 1984, we have been providing customers around the world the most complete engineering solution in the electronics industry. Many bright engineers from different parts of the world have joined together in SAMTRONIX to create a depth knowledge and skills unsurpassed. Read more...
Welcome to SAMTRONIX
Part of GILAVAR Engineering Group
SAMTRONIX is a Turnkey Solution
Full Engineering Services
Reverse Engineering
Contract Manufacturing
SAMTRONIX offer turnkey Engineering and Manufacturing services.
Engineering ServicesPCB Layout
SAMTRONIX perform as a seamless extension of our customers’ internal design capabilities. Getting involved early in the product development process and working closely with their own engineering team, we work to exceed our customers’ goals and time-to-market expectations by using proven engineering design principles and practices
Reverse Engineering
SAMTRONIX can reverse engineer your own designs if company has little or no documentation for your own product. If your current design firm or manufacturer refuses to release design details and manufacturing files. Another reason is cost. Some boards are considered proprietary by the OEM when in fact they are not; they are just too expensively priced. Re-engineering a PCB assembly can provide improved or added performance to an old process improving operations, maintenance and support. A design engineer checks the emerging schematic to see that it makes sense.
PCB Layout
offering a PCB Layout and schematic capturing services which emphasize design skills far beyond regular PCB designers and CAD drafters. Projects are managed by an experienced electrical engineer to define current and heat distribution, EMI, cross-talks and preparation of manufacturing documentation. In addition we can create Solidworks assembly file to represent the PCB in mechanical designs.
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Contract Manufacturing
SAMTRONIX production capabilities includes integrations with:
GED. San Marcos, CA. Here we can offer rare Hybrid assembly. Ceramic substrate are assembled in-house. Interconnections on ICs and substrate are made with wire bonding capability – either by Al wedge bonding or Au ball bonding. Resistance Projection, Cold and Seam Welding.
NJPCB. NanJing, China. Fully equipped facility for high volume turnkey assembly. Here we are offering excellent quality service for unbeatable price. Full turnkey assembly and drop-shipping services.